🚀 Automatic Stencil and Squeegee Change in DEK TQ Printers: Revolutionizing SMT Production! 🚀

[Alper Aktaş]

Next-Generation Automation for SMT Lines from ASMPT​

ASMPT is transforming stencil and squeegee changes in SMT production lines from start to finish with its automated setup change option developed for the DEK TQ printer platform. This innovative system minimizes manual intervention, significantly reducing the time operators spend at the machine.

⚙️ How Does the System Work?​

In the new system, the stencil and consumable cartridge (including squeegees) are prepared as a pre-assembled configuration. Operators load this combined assembly directly into the machine. Thanks to sensor technology, the print head automatically recognizes the squeegees and cartridge, mechanically engages them, and begins the printing process.

During production, the consumable unit remains in the printing area. At the moment of change, the remaining solder paste roll is transferred directly to the new stencil. An integrated camera barcode reader confirms the setup is correct.

⏱️ Significant Gains in Time and Efficiency​

Traditional manual changes took approximately four minutes, requiring operators to remove squeegees and stencils, check support pins, and manually perform alignment. With the automated process, manual intervention is reduced to just 30 seconds! Operators simply open the access cover, retrieve the used stencil and squeegees left by the print head, insert the pre-configured new assembly, and close the cover.

• Manual Change: Approximately 4 minutes
  
• Automated Change: Approximately 30 seconds
  

🔒 Process Reliability and Hardware​

The automated change prevents incorrect assembly thanks to a "poka-yoke" (mistake-proofing) compliant adapter. Automatic squeegee pickup ensures repeatable change cycles. Martin Moggeridge, Senior Product Manager for ASMPT SMT Solutions, states, "Solder paste printing is one of the processes in an SMT line that requires intensive operator involvement. With our new, innovative automated setup change solution, we significantly reduce the need for manual assistance while also lowering the risk of operator errors."

Hardware components for the automated change option include a special print head, squeegees, a consumable cartridge, an adapter module, and operating software. This system is offered as a configuration option for new DEK TQ units and is also available as an upgrade kit for existing installations.

🔬 Technical Details​

In high-mix or high-volume surface mount, solder paste printing is critical in terms of print head alignment accuracy, squeegee pressure consistency, and snap-off mechanics. This class of SMT stencil printers typically operates with alignment capabilities designed for high-density interconnect substrates and often maintains alignment accuracies around ±12.5 microns at 2 Cpk. Industrial stencil frames accommodate standard sizes up to 29 inches and typically support foil thicknesses ranging from 80 to 150 micrometers. The automatic connection of the squeegee to the aperture isolates the solder paste roll from environmental conditions (such as cleanroom temperature and humidity changes). This prevents effects that could alter paste rheology and accelerate solvent evaporation during manual interventions.