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🚀 New Generation Communication Module from Hilscher for Compact Devices: comX 90CN!

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  • AQUA Automation
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    ✨ Hilscher Revolutionizes Industrial Devices!​


    Hilscher has introduced its new embedded communication module, comX 90CN, designed for compact industrial devices. This innovative module offers manufacturers (OEMs) flexibility in network interface placement and multi-protocol support.

    ⚙️ Advantages of Connectorless Design​


    Unlike traditional modules, the comX 90CN does not feature fixed network ports. This allows OEMs to route and position physical connectors directly onto their device's main boards. This architecture significantly simplifies mechanical design and integration, especially in space-constrained devices such as robotic end-effectors, drives, and specialized automation hardware.

    🌐 Multi-Protocol Support and Compact Structure​


    Developed around Hilscher's netX 90 system-on-chip (SoC) communication controller, the comX 90CN boasts a compact 30 × 70 mm form factor. The module supports numerous Real-Time Ethernet protocols, including PROFINET, EtherCAT, EtherNet/IP, Modbus/TCP, CC-Link IE Field Basic, POWERLINK, and Sercos. Additionally, it simultaneously supports Industrial Internet of Things (IIoT) protocols like OPC UA and MQTT, ensuring seamless data flow for status monitoring and predictive maintenance without affecting real-time control.

    🔒 Hardware Security Features​


    Given increasing cybersecurity concerns in industrial networks, the comX 90CN leverages the native security architecture of the netX 90 processor. The module includes features such as hardware-assisted cryptographic engines, Secure Boot validation, user access control, and robust certificate and key management. These integrated hardware functions ensure that connected field instruments meet evolving cybersecurity standards.

    💡 Separating Physical Layer Connectors in Embedded Design​


    In compact industrial instrumentation, physical RJ45 or M12 connectors represent the primary bottleneck for internal enclosure packaging, thermal dissipation, and ingress protection (IP rating) design. Traditional plug-and-play communication modules fix the physical orientation and form factor of these connectors, forcing mechanical engineers to adapt the entire device enclosure to the third-party board. By bypassing the connectors and exposing the physical layer (PHY) signals via high-density main board headers, the comX 90CN decouples the communication controller logic from mechanical termination. This allows OEMs to position right-angle, slim, or high-durability sealed connectors anywhere on the main board, optimize high-speed signal routing, and maintain strict IP67/IP69K sealing envelopes without compromising multi-protocol flexibility.
     
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