🚀 Smart Manufacturing Show by Yamaha Robotics at EFX 2026! 🚀

[Cengiz Özemli]

Yamaha Robotics Showcases SMT Innovations at EFX 2026​

Yamaha Robotics is set to unveil its surface mount automation technologies at the EFX 2026 Electronics Manufacturing Exhibition, taking place in Stuttgart from October 6-8. At booth 9B50 in Hall 9, the company will showcase its integrated manufacturing ecosystem, dubbed "1 STOP SMART SOLUTION."

One-Stop Smart Solution: Revolutionizing Production​

This solution seamlessly integrates solder paste printing, component placement, and automated optical inspection (AOI). Managed by YSUP smart factory software, the system streamlines line programming, provides real-time production analysis via a customizable dashboard, and ensures full traceability throughout the manufacturing process.

Featured Products and Innovations​

• YRP10 and YRP10e Printers: Highly automated and entry-level models.
  
• YRM10 and YRM20 Placers: Models offering high-speed placement capabilities. Updates to the YRM platform reduce operator workload with automatic nozzle testing and pre-placement component tolerance checks.
  
• YRi-V AOI System: Utilizing the same robust chassis as the YRM placers, this system delivers high-quality imaging and fast scanning speeds. New AI tools accelerate component library creation, automate defect classification, and facilitate new product introductions (NPI).
  

High Speed and Precision​

Miniaturization and high-density PCB layouts in modern SMT lines demand unprecedented placement speed and inspection precision. The Yamaha YRM20 placer meets this need with a super high-speed rotary head capable of achieving placement speeds of up to 115,000 components per hour (CPH).

The high-performance YRi-V TypeHS system keeps pace with this rapid assembly process by integrating a 25-megapixel camera and a high-performance 3D line laser. This configuration enables high-resolution 3D inspections at 7 µm and 5 µm resolutions, making the inspection process 1.6 times faster than traditional models. This ensures accurate detection of ultra-small 0201 (0.25mm x 0.125mm) chips and shiny components.

The interconnection of these machines via the central YSUP software eliminates "black boxes" between equipment, creating a highly coordinated, intelligent factory network.