Erkan Teskancan
Corporate
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The rapid increase in electrification, the rise of artificial intelligence (AI), and the modernization of industrial energy infrastructure are fundamentally changing the design of power semiconductors. Infineon Technologies AG, a pioneer in this transformation, is preparing to showcase its latest innovations in these areas at PCIM Europe 2026.
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π‘ Infineon's Power Electronics Strategy
PCIM Europe 2026 will take place in Nuremberg, Germany, from June 9-11, bringing together suppliers, system architects, and engineers in the fields of power electronics, energy management, and intelligent motion control. At Hall 7, Booth 470, Infineon will present demonstrations focusing on system-level power conversion architectures rather than individual semiconductor component launches.
The company's exhibition covers four main application areas: grid infrastructure, AI data centers, electromobility, and robotics. This aligns with broader industrial trends where power electronics are becoming increasingly decisive in terms of system efficiency, thermal performance, fault tolerance, and compatibility.
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βοΈ Semiconductor Architectures for Power Infrastructure Modernization
Power infrastructure is under immense pressure due to increasing electrification loads, distributed renewable energy generation, and higher resilience requirements. Infineon's demonstrations in this area focus on battery energy storage systems, uninterruptible power supplies (UPS), solid-state transformers (SSTs), and solid-state circuit breakers (SSCBs).
[]Solid-State Transformers (SSTs): Replacing traditional low-frequency transformer architectures, SSTs enable bidirectional power flow, higher switching frequencies, and better integration with DC-based energy systems.
[]Solid-State Circuit Breakers (SSCBs): Utilizing silicon carbide (SiC) JFET-based architectures, these systems play a critical role in protecting high-power DC infrastructure, especially in DC microgrids, by providing fault isolation within milliseconds.
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π AI Data Center Power Conversion and Digital Infrastructure
The growth of AI data centers is reshaping power conversion architecture. High-density accelerator workloads increase energy demand, driving infrastructure operators towards more efficient distribution architectures, including HVDC side systems and DC microgrids.
Infineon's PCIM demonstrations cover semiconductor building blocks across the entire power chain, from grid connection to processor-level voltage regulation. These include power semiconductors, gate drivers, microcontrollers, sensors, battery backup solutions, and intelligent protection devices.
This reflects a practical engineering shift: AI infrastructure demands tighter control over conversion losses, thermal density, and power delivery efficiency, especially where multiple conversion stages can exacerbate energy waste.
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π Automotive Power Electronics for Electromobility
Infineon will also present its semiconductor solutions for traction inverters, DC-DC converters, on-board chargers, and battery management systems.
[]Traction Inverters: Require efficient high-voltage switching under heavy load.
[]On-Board Chargers: Prioritize conversion efficiency and packaging density.
- Battery Management Systems: Require precise sensing and safety control.
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π€ Robotic Power and Motion Control Systems
Robotics represents another expanding semiconductor application area, especially as systems evolve towards sensor-rich autonomous platforms.
Infineon's robotics demonstrations include motor control, power management, microcontroller-based control architectures, and sensor integration for industrial robots, home automation systems, humanoid platforms, and drones.
Semiconductor efficiency in robotic systems directly impacts thermal constraints, battery life, actuator responsiveness, and form factor. Gallium nitride (GaN) power devices are particularly important where compact switching architectures and reduced conversion losses support higher-performance motion control.
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π Cybersecurity Compliance in Embedded Power Systems
A notable aspect of Infineon's PCIM participation is its focus on the EU Cyber Resilience Act. As industrial electronics become increasingly networked, cybersecurity is moving from a software layer consideration to embedded hardware design.
Infineon states that its semiconductor strategy includes secured-by-design architectures intended to support regulatory compliance. For OEMs developing connected industrial, automotive, and infrastructure systems, cybersecurity increasingly intersects with semiconductor selection, especially where lifecycle risk and certification requirements are significant.
In summary, Infineon's presentations at PCIM Europe 2026 clearly demonstrate that power semiconductors form the foundation of modern technology and play a critical role in future innovations. By combining different technologies such as silicon, silicon carbide, and gallium nitride, the company aims to offer groundbreaking solutions in energy efficiency and system security.


















