AI-Edge Fanless Panel PCs for Software-Defined Manufacturing

[Ahmet Ö.]

## AI-Edge Fanless Panel PCs for Software-Defined Manufacturing

To bridge the gap between industrial automation and real-time AI data processing, Nexcom has introduced its next-generation APPC C21-01 series. This series features fanless panel PCs powered by the Intel® Core Ultra 5 125U (Meteor Lake-U) processor, combining energy efficiency with advanced AI acceleration.

### Advanced Technology and Durability
The APPC 160/210 C21 series is designed for 24/7 silent operation in demanding industrial environments. It offers 15.6-inch and 21.5-inch Full HD (1920 × 1080) display options, equipped with 10-point P-Cap touch technology. The front panel boasts IP65 protection, ensuring resistance against external factors like water and dust. Its slim, fanless design reduces maintenance needs while facilitating easy integration into existing machinery or control panels.

### Comprehensive Connectivity and Security Features
The device provides four Gigabit Ethernet LAN ports for industrial communication, numerous USB ports, and dual RS-232/485 COM ports. M.2 and mini-PCIe slots allow for additional hardware options such as wireless modules or extra storage. Furthermore, a built-in TPM 2.0 module provides hardware-based security, and it supports Windows IoT and Ubuntu Linux. When integrated with the NexVIC series, it offers remote hardware monitoring and low-code workflow customization features.

### Ready for Future Industrial Applications
Introduced at Embedded World 2026, the APPC series is part of NEXCOM's portfolio addressing the "Physical AI" trend. This series, along with the MARS400 T10-05 robotic controller for humanoid robots and eSAF Guardian software for OT security, enables on-site GenAI and real-time inference. This contributes to operational resilience and reduced time-to-market in smart city and transportation infrastructures.